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TTPCom intros semi-open 3G phone, iA platformBy John Walko
Dubbed Ajar, the platform comprises the complete applications software required for developing feature phones. The extra differentiation comes from the inclusion of a rapid and customizable man-machine-interface (MMI) toolkit and other design tools.
There is an applications framework for Java, C++ and DSPs, customizable real reference phones and TTPCom's well established protocol stacks for GSM, GPRS and EDGE. The protocol software is fully compatible with silicon from TTPCom's numerous semiconductor partners
Neil Werdmuller, Applications Product Manager at TTPCom commented “Ajar is neither fully closed, and therefore inflexible, nor fully open, with the potential branding and security problems that this presents. In addition it does not require additional processing power and so can be implemented in all levels of handset from entry level to high-end smartphones. The flexibility that Ajar brings to the handset is absolutely key to keeping pace with a fast changing market, enabling new services to be added as soon as they become available”.
Werdmuller said the MMI design tools that are a key feature of Ajar are so flexible that phone manufacturers will be able to customize the look and feel of their phones to meet the branding requirements of every network operator that they work with.
For the network operator Ajar provides an opportunity to take more control of the content of the phone, to download new services quickly to users and to develop a consistent brand image across a complete range of handsets
The platform delivers applications technology such as Java, unified messaging service with multimedia messaging service (MMS) and email client, WAP2.0, digital camera support, embedded and downloadable wireless games and multimedia content. Users will be provided with an annual upgrade to ensure that the applications suite is always up to date.
Separately, TTPCom said one of its semiconductor partners, Matsushita Electric, has just delivered the first fully functional silicon of a 3GPP (3rd Generation Partnership Project) transceiver design based on its reference designs. Full system evaluation is now under way at TTPCom's testing facilities, with samples expected to be shipped to selected customers during the second half of the year.
The companies are also collaborating on a dual GSM/3G transceiver, with silicon for this also expected in mid 2003.
TTPCom's RFIC product manager Gerry Stanton outlined a technology roadmap that showed the company integrating in CMOS an RF and mixed signal IC by next year, and “more Blue Sky, and more problematic, a single chip cellphone chip in CMOS in 2005”.
One of the biggest problems to overcome, according to Stanton, particularly for 3G, where it is necessary to provide simultaneous receive/transmission, is the isolation issue. “We, and many in the semiconductor industry are looking at how isolation between different parts can be achieved, and we are confident it can be done in CMOS. But it is a big challenge”.
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